Patent Assignment
Reel/Frame 048680/0756
Assignment of Assignor's Interest
Recorded: 2019-03-22
Pages: 3
Assignor
RATEZE REMOTE MGMT. L.L.C.
Executed: 2019-02-22
Assignee
INTELLECTUAL VENTURES ASSETS 113 LLC
251 LITTLE FALLS DRIVE, WILMINGTON, DELAWARE, 19808
Covered Properties
(2)
Method and Apparatus for Evaluating a Known Good Die Using Both Wire Bond and Flip-Chip Interconnects
Patent:
6,221,682 →
Application:
09/321,565 →
Method and Apparatus for Evaluating a Known Good Die Using Both Wire Bond and Flip-Chip Interconnects
Patent:
43,607 →
Application:
11/809,901 →
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.