IP Library › Assignment 048754/0835
Patent Assignment
Reel/Frame 048754/0835

Assignment of Assignor's Interest

Recorded: 2019-04-01 Pages: 4
Assignors
JIANG, XIAOYU
Executed: 2019-03-18
XIA, HAI
Executed: 2019-03-18
CHEN, FEIBIAO
Executed: 2019-03-18
GUO, SONG
Executed: 2019-03-18
Assignee
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
1525 ZHANGDONG ROAD, ZHANGJIANG HIGH-TECH PARK, SHANGHAI, 201203, CHINA
Covered Property (1)
Batch Bonding Apparatus and Bonding Method
Application: 16/338,551 →
Publication: US 2019/0385972
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
To: AMIES TECHNOLOGY CO., LTD.
Reel/Frame 072912/0466 →