Patent Assignment
Reel/Frame 048793/0949
Assignment of Assignor's Interest
Recorded: 2019-04-04
Pages: 8
Assignors
NAGATA, ATSUSHI
Executed: 2019-04-03
MAEDA, HIROSHI
Executed: 2019-03-22
SUGAKAWA, KENJI
Executed: 2019-03-25
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Bonding System and Bonding Method