Bonding system and bonding method
A bonding system includes a surface modifying apparatus, a surface hydrophilizing apparatus and a bonding apparatus. The surface modifying apparatus is configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate with plasma. The surface hydrophilizing apparatus is configured to hydrophilize the modified bonding surfaces of the first substrate and the second substrate. The bonding apparatus includes a condensation suppressing gas discharge unit, and is configured to bond the hydrophilized bonding surfaces of the first substrate and the second substrate by an intermolecular force. The condensation suppressing gas discharge unit is configured to discharge a condensation suppressing gas toward a space between a peripheral portion of the bonding surface of the first substrate and a peripheral portion of the bonding surface of the second substrate facing each other.
1. A bonding system, comprising:
a surface modifying apparatus configured to modify a bonding surface of a first substrate and a bonding surface of a second substrate with plasma;
a surface hydrophilizing apparatus configured to hydrophilize the bonding surface of the first substrate and the bonding surface of the second substrate which have been modified by the surface modifying apparatus; and
a bonding apparatus, including a condensation suppressing gas discharge unit configured to discharge a condensation suppressing gas configured to suppress condensation toward a space between a peripheral portion of the bonding surface of the first substrate and a peripheral portion of the bonding surface of the second substrate facing each other, configured to bond the bonding surface of the first substrate and the bonding surface of the second substrate, which have been hydrophilized by the surface hydrophilizing apparatus, by an intermolecular force,
wherein the condensation suppressing gas discharge unit is equipped with at least one discharge opening through which the condensation suppressing gas is discharged, and
the at least one discharge opening is formed outside of the first and second substrates when viewed from above, along a circumferential direction of the condensation suppressing gas discharge unit.
2. The bonding system of claim 1 ,
wherein the condensation suppressing gas includes an inert gas.
3. The bonding system of claim 2 ,
wherein the condensation suppressing gas includes a He gas.
4. The bonding system of claim 1 ,
wherein the condensation suppressing gas includes dry air.
5. The bonding system of claim 1 ,
wherein the condensation suppressing gas discharge unit is further equipped with a main body that has a circular ring shape.
6. The bonding system of claim 5 ,
wherein the at least one discharge opening is uniformly formed along a circumferential direction in the main body of the condensation suppressing gas discharge unit.
7. A bonding method, comprising:
modifying a bonding surface of a first substrate and a bonding surface of a second substrate;
hydrophilizing the modified bonding surface of the first substrate and the modified bonding surface of the second substrate;
discharging a condensation suppressing gas configured to suppress condensation toward a space between a peripheral portion of the bonding surface of the first substrate and a peripheral portion of the bonding surface of the second substrate facing each other; and
bonding the hydrophilized bonding surface of the first substrate and the hydrophilized bonding surface of the second substrate by an intermolecular force,
wherein the discharging of the condensation suppressing gas is performed by a condensation suppressing gas discharge unit,
the condensation suppressing gas discharge unit is equipped with at least one discharge opening through which the condensation suppressing gas is discharged, and
the at least one discharge opening is formed outside of the first and second substrates when viewed from above, along a circumferential direction of the condensation suppressing gas discharge unit.