IP Library › Assignment 048803/0718
Patent Assignment
Reel/Frame 048803/0718

Assignment of Assignor's Interest

Recorded: 2019-04-05 Pages: 6
Assignors
WANG, TIANMING
Executed: 2019-03-28
JIANG, XIAOYU
Executed: 2019-03-18
XIA, HAI
Executed: 2019-03-18
CHEN, FEIBIAO
Executed: 2019-03-18
Assignee
SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
1525 ZHANGDONG ROAD, ZHANGJIANG HIGH-TECH PARK, SHANGHAI, 201203, CHINA
Covered Property (1)
Chip Bonding Apparatus and Bonding Method
Application: 16/338,260 →
Publication: US 2020/0144218
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
To: AMIES TECHNOLOGY CO., LTD.
Reel/Frame 072912/0466 →