IP Library › Assignment 048816/0818
Patent Assignment
Reel/Frame 048816/0818

Assignment of Assignor's Interest

Recorded: 2019-04-08 Pages: 3
Assignors
LIN, KEVIN
Executed: 2017-06-06
CHANDHOK, MANISH
Executed: 2017-06-06
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Vias and Gaps in Semiconductor Interconnects
Application: 16/337,889 →
Publication: US 2020/0027827
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072792/0266 →