Patent Assignment
Reel/Frame 072792/0266
Assignment of Assignor's Interest
Recorded: 2025-09-17
Pages: 70
Assignor
INTEL CORPORATION
Executed: 2025-08-19
Assignee
SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
10951 WHITE ROCK ROAD, RANCHO CORDOVA, CALIFORNIA, 95670
Covered Properties
(25)
Technologies for Combining Logical-to-Physical Address Table Updates in a Single Write Operation
Apparatus, System and Method for Offloading Collision Check Operations in a Storage Device
Apparatus, System and Method for Increasing the Capacity of a Storage Device Available to Store User Data
Application Based Checkpointing Control for Storage Device
Substrate with Variable Height Conductive and Dielectric Elements
Unidirectional Self-Aligned Gate Endcap (Sage) Architectures with Gate-Orthogonal Walls
Shrinkable Package Assembly
Active Package Substrate Having Anisotropic Conductive Layer
Compact Wirebonding in Stacked-Chip System in Package, and Methods of Making Same
Vias and Gaps in Semiconductor Interconnects
Vias and Gaps in Semiconductor Interconnects
Vertical Bond-Wire Stacked Chip-Scale Package with Application-Specific Integrated Circuit Die on Stack, and Methods of Making Same
Low Overhead, High Bandwidth Re-Configurable Interconnect Apparatus and Method
Multi-Die, Vertical-Wire Package-in-Package Apparatus, and Methods of Making Same
Etchstop Regions in Fins of Semiconductor Devices
Active Package Substrate Having Anisotropic Conductive Layer
Package Substrate with High-Density Interconnect Layer Having Pillar and via Connections for Fan Out Scaling
Encoding Additional States in a Three-Dimensional Crosspoint Memory Architecture
Selective Metal Removal for Conductive Interconnects in Integrated Circuitry
Unidirectional Self-Aligned Gate Endcap (Sage) Architectures with Gate-Orthogonal Walls
Programmable and High-Performance Data Scrambler for Non-Volatile Memory Controllers
Read Algorithms for Three-Dimensional Crosspoint Memory Architectures
Fast Memory Ecc Error Correction
Cooling Mass and Spring Element for Low Insertion Force Hot Swappable Electronic Component Interface
Techniques to Improve Latency of Retry Flow in Memory Controllers
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 4, 2016
From: LI, PENG; RAMALINGAM, ANAND S.; LUI, WILLIAM K.; TRIKA, SANJEEV N.
To: INTEL CORPORATION
Reel/Frame 039934/0550 →
Assignment of Assignor's Interest
Jan 26, 2017
From: LI, PENG; RAMALINGAM, ANAND S.; KHAN, JAWAD B.; LUI, WILLIAM K.
To: INTEL CORPORATION
Reel/Frame 041513/0001 →
Assignment of Assignor's Interest
Feb 3, 2017
From: LI, PENG; LUI, WILLIAM K.; TRIKA, SANJEEV N.
To: INTEL CORPORATION
Reel/Frame 041627/0225 →
Assignment of Assignor's Interest
Mar 9, 2018
From: ALEKSOV, ALEKSANDAR; DARMAWIKARTA, KRISTOF; CHEN, HAOBO; LIU, CHANGHUA
To: INTEL CORPORATION
Reel/Frame 045163/0526 →
Assignment of Assignor's Interest
Dec 5, 2018
From: HAFEZ, WALID M.; GOVINDARAJU, SRIDHAR; LIU, MARK; LIAO, SZUYA S.
To: INTEL CORPORATION
Reel/Frame 047684/0251 →
Assignment of Assignor's Interest
Feb 21, 2019
From: PON, FLORENCE; XU, YI; LAI, MIN-TIH
To: INTEL CORPORATION
Reel/Frame 048401/0990 →
Assignment of Assignor's Interest
Apr 8, 2019
From: LIN, KEVIN; CHANDHOK, MANISH
To: INTEL CORPORATION
Reel/Frame 048816/0818 →
Assignment of Assignor's Interest
Apr 26, 2019
From: LIN, KEVIN
To: INTEL CORPORATION
Reel/Frame 049014/0153 →
Assignment of Assignor's Interest
May 5, 2020
From: LIU, HUICHU; KARNIK, TANAY; SINGH, TEJPAL; LIU, YEN-CHENG
To: INTEL CORPORATION
Reel/Frame 052578/0747 →
Assignment of Assignor's Interest
May 7, 2020
From: SUKHOMLINOV, VADIM; TRIKA, SANJEEV N.
To: INTEL CORPORATION
Reel/Frame 052597/0082 →
Assignment of Assignor's Interest
Nov 16, 2020
From: MAY, ROBERT ALAN; BOYAPATI, SRI RANGA SAI; DARMAWIKARTA, KRISTOF KUWAWI; PIETAMBARAM, SRINIVAS V.
To: INTEL CORPORATION
Reel/Frame 054375/0635 →
Assignment of Assignor's Interest
May 22, 2023
From: DOMINGUEZ, JUAN EDUARDO; KIM, HYOUNG IL
To: INTEL CORPORATION
Reel/Frame 063714/0175 →