Patent Assignment
Reel/Frame 054375/0635
Assignment of Assignor's Interest
Recorded: 2020-11-16
Pages: 6
Assignors
MAY, ROBERT ALAN
Executed: 2016-12-19
BOYAPATI, SRI RANGA SAI
Executed: 2016-12-19
DARMAWIKARTA, KRISTOF KUWAWI
Executed: 2016-12-19
PIETAMBARAM, SRINIVAS V.
Executed: 2016-12-19
GONZALEZ, JAVIER SOTO
Executed: 2016-12-19
LIM, KWANGMO CHRIS
Executed: 2016-12-15
ALEKSOV, ALEKSANDAR
Executed: 2016-12-20
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package Substrate with High-Density Interconnect Layer Having Pillar and via Connections for Fan Out Scaling
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.