Shrinkable package assembly
A semiconductor structure is disclosed. The semiconductor structure includes a substrate an elastomer coupled to the substrate and a plurality of bondfingers on the elastomer. The substrate, the elastomer and the bondfingers are configured to cooperatively expand and retract.
1. A semiconductor structure, comprising:
a substrate;
an elastomer coupled to the substrate; and
a plurality of bondfingers formed on the elastomer, the substrate, the elastomer and the bondfingers configured to cooperatively expand and retract, wherein the bondfingers include pre-wrinkled foil, the pre-wrinkled foil having a plurality of wrinkles, individual ones of the plurality of wrinkles having a protrusion between first and second non-protruding portions, the protruding portion having a height greater than a height of both the first and second non-protruding portions.
2. The semiconductor structure of claim 1 , wherein the bondfingers include a serpentine pattern of interconnected parts.
3. The semiconductor structure of claim 1 , wherein the bondfingers are configured to be expanded before wirebonding.
4. The semiconductor structure of claim 1 , wherein the bondfingers are configured to be retracted after wirebonding.
5. The semiconductor structure of claim 1 , wherein the substrate is configured to be expanded in response to an application of heat to the semiconductor structure.
6. The semiconductor structure of claim 1 , wherein the substrate is configured to have an expansion of the substrate.
7. A semiconductor package, comprising:
a substrate;
a die coupled to a substrate;
an elastomer coupled to the substrate;
a plurality of bondfingers formed on the elastomer, the substrate, the elastomer and the bondfingers configured to cooperatively expand and retract, wherein the bondfingers include pre-wrinkled foil, the pre-wrinkled foil having a plurality of wrinkles, individual ones of the plurality of wrinkles having a protrusion between first and second non-protruding portions, the protruding portion having a height greater than a height of both the first and second non-protruding portions; and
a plurality of wire bonds coupled to the bondfingers and to the die.
8. The semiconductor package of claim 7 , wherein the bondfingers include a serpentine pattern of interconnected parts.
9. The semiconductor package of claim 7 , wherein the bondfingers are configured to be expanded before wirebonding.
10. The semiconductor package of claim 7 , wherein the bondfingers are configured to be retracted after wirebonding.
11. The semiconductor package of claim 7 , wherein the substrate is configured to be expanded in response to an application of heat to the semiconductor package.
12. The semiconductor package of claim 7 , wherein the substrate is configured to have an expansion of the substrate.
13. A method, comprising:
forming a substrate;
forming an elastomer on the substrate; and
forming bondfingers on the elastomer, wherein the substrate, the elastomer and the bondfingers are configured to cooperatively expand and retract, wherein the bondfingers include pre-wrinkled foil, the pre-wrinkled foil having a plurality of wrinkles, individual ones of the plurality of wrinkles having a protrusion between first and second non-protruding portions, the protruding portion having a height greater than a height of both the first and second non-protruding portions.
14. The method of claim 13 , wherein the bondfingers include a serpentine pattern of interconnected parts.
15. The method of claim 13 , wherein the bondfingers are configured to be expanded before wirebonding.
16. The method of claim 13 , wherein the bondfingers are configured to be retracted after wirebonding.
17. The method of claim 13 , wherein the substrate is configured to be expanded in response to an application of heat to the substrate.