IP Library › Assignment 048833/0486
Patent Assignment
Reel/Frame 048833/0486

Assignment of Assignor's Interest

Recorded: 2019-04-09 Pages: 7
Assignors
TAPIAS, NICHOLAS R.
Executed: 2019-04-05
SAPRA, SANJEEV
Executed: 2019-04-05
KHANDEKAR, ANISH A.
Executed: 2019-04-08
HU, SHEN
Executed: 2019-04-08
Assignee
MICRON TECHNOLOGY, INC.
8000 SOUTH FEDERAL WAY, BOISE, IDAHO, 83716-9632
Covered Property (1)
Semiconductor Structure Formation
Application: 16/379,085 →
Publication: US 2020/0328080
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 12 to Patent Security Agreement Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 048948/0677 →
Supplement No. 3 to Patent Security Agreement Apr 19, 2019
From: MICRON TECHNOLOGY, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 048951/0902 →
Release of Security Interest Oct 14, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050724/0392 →
Release of Security Interest Nov 15, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 051041/0317 →