Patent Assignment
Reel/Frame 048862/0481
Assignment of Assignor's Interest
Recorded: 2019-04-11
Pages: 4
Assignors
TSAI, PO-HAO
Executed: 2019-03-26
WONG, TECHI
Executed: 2019-03-26
LIN, MENG-LIANG
Executed: 2019-03-26
WU, YI-WEN
Executed: 2019-03-26
CHUANG, PO-YAO
Executed: 2019-03-26
JENG, SHIN-PUU
Executed: 2019-03-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure with Dam Structure and Method for Forming the Same