IP Library › Assignment 048864/0703
Patent Assignment
Reel/Frame 048864/0703

Assignment of Assignor's Interest

Recorded: 2019-04-11 Pages: 6
Assignors
FAY, OWEN R.
Executed: 2015-05-12
MURRAY, JACK E.
Executed: 2015-05-18
Assignee
MICRON TECHNOLOGY, INC.
8000 S. FEDERAL WAY, P.O. BOX 6, BOISE, IDAHO, 83707-0006
Covered Property (1)
Package-On-Package Semiconductor Assemblies and Methods of Manufacturing the Same
Application: 16/027,041 →
Publication: US 2018/0315689
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Supplement No. 9 to Patent Security Agreement Aug 9, 2018
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 047282/0463 →
Release of Security Interest Oct 11, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050713/0001 →