Patent Assignment
Reel/Frame 048870/0690
Assignment of Assignor's Interest
Recorded: 2019-04-12
Pages: 4
Assignors
KUNG, CHUN-HAO
Executed: 2019-03-29
CHANG, CHIH-CHIEH
Executed: 2019-04-01
LIAO, KAO-FENG
Executed: 2019-03-29
HUANG, HUI-CHI
Executed: 2019-04-01
CHEN, KEI-WEI
Executed: 2019-04-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure with Interconnect Structure and Method for Forming the Same