Patent Assignment
Reel/Frame 048876/0603
Assignment of Assignor's Interest
Recorded: 2019-04-12
Pages: 5
Assignors
VAN DAL, MARK
Executed: 2016-12-16
DOORNBOS, GERBEN
Executed: 2016-12-16
PASSLACK, MATTHIAS
Executed: 2016-12-27
HOLLAND, MARTIN CHRISTOPHER
Executed: 2016-12-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Iii-V Semiconductor Layers, Iii-V Semiconductor Device and Methods of Manufacturing Thereof