IP Library › Granted Patent US 10,680,062
Granted Patent B2
US 10,680,062 · App. 16/383,528 · Granted Jun 9, 2020

III-V semiconductor layers, III-V semiconductor device and methods of manufacturing thereof

Inventors: Mark Van Dal (Linden, BE); Gerben Doornbos (Kessel-Lo, BE); Matthias Passlack (Huldenberg, BE); Martin Christopher Holland (Bertem, BE)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
H01L29/0673B82Y10/00H01L21/30604H01L29/0649H01L29/1079H01L29/20H01L29/42364H01L29/42376H01L29/6656H01L29/66469H01L29/66522H01L29/66545H01L29/66742H01L29/775H01L29/7853H01L29/7854H01L29/045H01L29/66439
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Quick Facts
Patent No.
US 10,680,062
App. No.
16/383,528
Granted
Jun 9, 2020
Kind
B2
Abstract

A gate-all-around field effect transistor (GAA FET) includes an InAs nano-wire as a channel layer, a gate dielectric layer wrapping the InAs nano-wire, and a gate electrode metal layer formed on the gate dielectric layer. The InAs nano-wire has first to fourth major surfaces three convex-rounded corner surfaces and one concave-rounded corner surface.

Claims (46)

1. A gate-all-around field effect transistor (GAA FET), comprising:

a nano-wire made of a Group III-V semiconductor as a channel layer;

a gate dielectric layer wrapping the nano-wire; and

a gate electrode metal layer formed on the gate dielectric layer, wherein:

the nano-wire has first, second, third and fourth major faces, first, second and third convex-rounded corner faces and one concave-rounded corner face.

2. The GAA FET of claim 1 , wherein the Group III-V semiconductor is InAs.

3. The GAA FET of claim 1 , further comprising:

a bottom fin structure, over which the nano-wire is disposed and which extends along a first direction,

wherein the gate electrode metal layer extends along a second direction crossing the first direction.

4. The GAA FET of claim 3 , wherein in the second direction, a width of the nano-wire covered by the gate electrode metal layer is greater than a width of the bottom fin structure.

5. The GAA FET of claim 4 , wherein an upper surface of the bottom fin structure has a V-shaped concave shape.

6. The GAA FET of claim 5 , wherein the width of the bottom fin structure is measured at a bottom of the V-shaped concave shape.

7. The GAA FET of claim 4 , wherein the gate dielectric layer is also formed on an upper surface of the bottom fin structure.

8. The GAA FET of claim 4 , further comprising a void disposed in the gate electrode metal layer between the nano-wire and the bottom fin structure.

9. The GAA FET of claim 8 , further comprising a source and a drain,

wherein the void extends below the source and the drain.

10. The GAA FET of claim 4 , wherein no void is disposed in the gate electrode metal layer between the nano-wire and the bottom fin structure.

11. The GAA FET of claim 1 , wherein:

the first convex-rounded corner face connects the first major face and the second major face,

the concave-rounded corner face connects the second major face and the third major face,

the second convex-rounded corner face connects the third major face and the fourth major face, and

the third convex-rounded corner face connects the fourth major face and the first major face.

12. The GAA FET of claim 1 , wherein:

extended planes of the first major face and the second major face make an acute angle,

extended planes of the second major face and the third major face make an angle of 60° to 150°,

extended planes of the third major face and the fourth major face make an acute angle, and

extended planes of the fourth major face and the first major face make an acute angle.

13. The GAA FET of claim 12 , wherein the extended planes of the second major face and the third major face make an angle of 90° to 150°.

14. A gate-all-around field effect transistor (GAA FET), comprising:

a bottom fin structure extending in a first direction;

an InAs nano-wire as a channel layer; and

a gate electrode extending in a second direction crossing the first direction, and including a gate dielectric layer wrapping the InAs nano-wire and a gate electrode metal layer formed on the gate dielectric layer, wherein:

the InAs nano-wire has a triangular cross section with rounded corners, and

in the second direction, a width of the InAs nano-wire under the gate electrode is greater than a width of the bottom fin structure.

15. The GAA FET of claim 14 , wherein an upper surface of the bottom fin structure has a V-shaped concave shape.

16. The GAA FET of claim 15 , wherein the width of the bottom fin structure is measured at a bottom of the V-shaped concave shape.

17. The GAA FET of claim 14 , wherein the gate dielectric layer is also formed on an upper surface of the bottom fin structure.

18. The GAA FET of claim 14 , further comprising a void disposed in the gate electrode metal layer between the nano-wire and the bottom fin structure.

19. The GAA FET of claim 18 , further comprising a source region and a drain,

wherein the void extends below the source and the drain.

20. A gate-all-around field effect transistor (GAA FET), comprising:

a bottom fin structure extending in a first direction;

an InAs nano-wire as a channel layer; and

a gate electrode extending in a second direction crossing the first direction, and including a gate dielectric layer wrapping the InAs nano-wire and a gate electrode metal layer formed on the gate dielectric layer, wherein:

the InAs nano-wire has a boomerang shape cross section, and

in the second direction, a width of the InAs nano-wire under the gate electrode is greater than a width of the bottom fin structure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 12, 2019
From: VAN DAL, MARK; DOORNBOS, GERBEN; PASSLACK, MATTHIAS; HOLLAND, MARTIN CHRISTOPHER
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 048876/0603 →
Continuity (3)
Division 15397508 · Jan 3, 2017
Provisional Application 62427591 · Nov 29, 2016
Related Publication 20190245037A1 · Aug 8, 2019