Patent Assignment
Reel/Frame 048887/0414
Assignment of Assignor's Interest
Recorded: 2019-04-15
Pages: 2
Assignor
SHIH, SHING-YIH
Executed: 2019-02-14
Assignee
NANYA TECHNOLOGY CORPORATION
NO. 98, NANLIN RD., TAISHAN DIST.,, NEW TAIPEI CITY, 243, TAIWAN
Covered Property
(1)
Semiconductor Package Including Hybrid Bonding Structure and Method for Preparing the Same