Patent Assignment
Reel/Frame 048908/0483
Assignment of Assignor's Interest
Recorded: 2019-04-17
Pages: 7
Assignors
SEO, JU-BIN
Executed: 2019-03-13
PARK, SU-JEONG
Executed: 2019-03-13
KIM, TAE-SEONG
Executed: 2019-03-13
MOON, KWANG-JIN
Executed: 2019-03-13
LIM, DONG-CHAN
Executed: 2019-03-13
CHOI, JU-IL
Executed: 2019-03-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having a Through Silicon via and Methods of Manufacturing the Same