Patent Assignment
Reel/Frame 048947/0567
Assignment of Assignor's Interest
Recorded: 2019-04-22
Pages: 6
Assignors
LEE, DONG-JIN
Executed: 2019-02-14
KIM, BONG-SOO
Executed: 2019-02-14
KIM, JI-YOUNG
Executed: 2019-04-09
YOO, HO-RIM
Executed: 2019-04-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device