Patent Assignment
Reel/Frame 048967/0554
Assignment of Assignor's Interest
Recorded: 2019-04-23
Pages: 5
Assignors
OH, KYUNG SUK
Executed: 2019-02-25
KIM, DO-HYUN
Executed: 2019-02-25
KANG, SUNWON
Executed: 2019-02-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Assembly Semiconductor Package Including the Same and Method of Manufacturing the Semiconductor Package