Substrate assembly semiconductor package including the same and method of manufacturing the semiconductor package
A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip and a connection structure. The second semiconductor chip includes a first segment that protrudes outwardly beyond one side of the first semiconductor chip and a second connection pad on a bottom surface of the first segment of the second semiconductor chip. The connection structure includes a first structure between the substrate and the first segment of the second semiconductor chip and a first columnar conductor penetrating the first structure to be in contact with the substrate and being disposed between the second connection pad and the substrate, thereby electrically connecting the second semiconductor chip to the substrate.
1. A semiconductor package, comprising:
a substrate;
a first semiconductor chip on the substrate;
a second semiconductor chip on the first semiconductor chip;
a third semiconductor chip on the second semiconductor chip; and
a connection structure,
wherein the second semiconductor chip comprises:
a first segment that protrudes outwardly beyond one side of the first semiconductor chip; and
a second connection pad on a bottom surface of the first segment of the second semiconductor chip,
wherein the third semiconductor chip comprises:
a first segment that protrudes outwardly beyond one side of the second semiconductor chip; and
a third connection pad on a bottom surface of the first segment of the third semiconductor chip, and
wherein the connection structure comprises:
a first structure between the substrate and the first segment of the second semiconductor chip;
a first columnar conductor penetrating the first structure to be in contact with the substrate and being disposed between the second connection pad and the substrate, thereby electrically connecting the second semiconductor chip to the substrate;
a second structure between the substrate and the first segment of the third semiconductor chip; and
a second columnar conductor disposed in the second structure and connected to the first columnar conductor, thereby electrically connecting the third semiconductor chip via the first columnar conductor to the substrate.
2. The semiconductor package of claim 1 , further comprising:
a molding layer covering the first and second semiconductor chips, and the connection structure,
wherein the first structure comprises a material different from a material of the molding layer.
3. The semiconductor package of claim 1 ,
wherein the first structure comprises a photo solder resist (PSR).
4. The semiconductor package of claim 3 ,
wherein the substrate comprises:
an upper conductive layer; and
an upper dielectric layer with a plurality of holes,
wherein the upper dielectric layer is disposed on the upper conductive layer,
wherein the first columnar conductor is connected to the upper conductive layer via one of the plurality of holes, and
wherein the first structure and the upper dielectric layer have the same dielectric material.
5. The semiconductor package of claim 1 ,
wherein a top surface of the first columnar conductor is in contact with a bottom surface of the second connection pad.
6. The semiconductor package of claim 1 ,
wherein the second semiconductor chip further comprises a first ball,
wherein the first columnar conductor and the second connection pad are electrically connected to each other through the first ball.
7. The semiconductor package of claim 1 , wherein
the first structure comprises a first top surface,
the second structure comprises a second top surface, and
a distance between the second top surface and the substrate is greater than a distance between the first top surface and the substrate.
8. The semiconductor package of claim 1 ,
wherein an area of the first semiconductor chip is the same as an area of the second semiconductor chip.