Patent Assignment
Reel/Frame 048973/0286
Assignment of Assignor's Interest
Recorded: 2019-04-23
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2019-03-20
HSIEH, YUN CHEN
Executed: 2019-03-20
TSAI, HUI-JUNG
Executed: 2019-03-20
KUO, HUNG-JUI
Executed: 2019-03-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Having Via Sidewall Adhesion With Encapsulant