Patent Assignment
Reel/Frame 049001/0469
Assignment of Assignor's Interest
Recorded: 2019-04-25
Pages: 4
Assignors
HAN, YING-SHIN
Executed: 2017-05-18
LIN, YEN-MIAO
Executed: 2017-05-18
CHEN, CHUNG-CHIH
Executed: 2017-05-18
MENG, HSIEN-LIANG
Executed: 2017-05-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Forming a Semiconductor Package