Patent Assignment
Reel/Frame 049012/0735
Assignment of Assignor's Interest
Recorded: 2019-04-26
Pages: 107
Assignor
KAMIMURA, TETSUYA
Executed: 2019-02-18
Assignee
FUJIFILM CORPORATION
26-30, NISHIAZABU 2-CHOME, MINATO-KU, TOKYO, 106-8620, JAPAN
Covered Property
(1)
Manufacturing Method of Semiconductor Chip, and Kit