Patent Assignment
Reel/Frame 049033/0464
Assignment of Assignor's Interest
Recorded: 2019-01-25
Pages: 3
Assignor
SHIH, SHING-YIH
Executed: 2018-10-02
Assignee
NANYA TECHNOLOGY CORPORATION
NO.98, NANLIN RD., TAISHAN DIST., NEW TAIPEI CITY, 243, TAIWAN
Covered Property
(1)
Method of Forming Fine Interconnection for a Semiconductor Device