Patent Assignment
Reel/Frame 049034/0320
Assignment of Assignor's Interest
Recorded: 2019-04-30
Pages: 3
Assignor
LIAW, JHON-JHY
Executed: 2017-10-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD.6, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Integrated Circuit Chip and Manufacturing Method Thereof