Integrated circuit chip and manufacturing method thereof
A method of manufacturing an integrated circuit chip includes doping a substrate with a p-type dopant to form a first p-well region in a first memory cell and a second p-well region in a second memory cell; forming first and second semiconductor fins over the first and second p-well regions, respectively; forming a first work function layer over the first semiconductor fin; forming a second work function layer over the second semiconductor fin and having a thickness different from a thickness of the first work function layer; and forming a metal fill layer over the first and second work function layers.
1. A method of manufacturing an integrated circuit chip, comprising:
doping a substrate with a p-type dopant to form a first p-well region in a first memory cell and a second p-well region in a second memory cell;
forming first and second semiconductor fins over the first and second p-well regions, respectively;
forming a first work function layer over the first semiconductor fin and being of a pull down device in the first memory cell;
forming a second work function layer over the second semiconductor fin, being of a pull down device in the second memory cell, and having a thickness different from a thickness of the first work function layer; and
forming a metal fill layer over the first and second work function layers.
2. The method of claim 1 , wherein forming the first and second work function layers is performed such that a material of the first work function layer is substantially the same as a material of the second work function layer.
3. The method of claim 1 , wherein forming the first and second work function layers is performed such that a material of the first work function layer is different from a material of the second work function layer.
4. The method of claim 1 , wherein the first work function layer includes TiN.
5. The method of claim 1 , wherein the first work function layer includes TiAl.
6. The method of claim 1 , further comprising forming a barrier layer over the first semiconductor fin prior to forming the first work function layer.
7. The method of claim 1 , further comprising forming a barrier layer over the second semiconductor fin prior to forming the second work function layer.
8. The method of claim 1 , further comprising:
forming a third work function layer over the first work function layer prior to forming the metal fill layer.
9. The method of claim 8 , further comprising:
forming a fourth work function layer over the second work function layer prior to forming the metal fill layer, such that a thickness of the fourth work function layer is substantially the same as a thickness of the third work function layer.
10. A method of manufacturing an integrated circuit chip, comprising:
doping a substrate with a n-type dopant to form a first n-well region in a first memory cell and a second n-well region in a second memory cell;
forming first and second semiconductor fins over the first and second n-well regions, respectively;
forming a first work function layer over the first semiconductor fin and being of a pull up device in the first memory cell;
forming a second work function layer over the second semiconductor fin, being of a pull down device in the second memory cell, and having a thickness different from a thickness of the first work function layer; and
forming a metal fill layer over the first and second work function layers.
11. The method of claim 10 , wherein forming the first and second work function layers is performed such that a material of the first work function layer is substantially the same as a material of the second work function layer.
12. The method of claim 10 , further comprising:
doping the substrate with a p-type dopant to form a p-well region in the first memory cell;
forming a third semiconductor fin over the p-well region; and
forming a third work function layer over the third semiconductor fin such that a thickness of the third work function layer is different from the thickness of the first work function layer.
13. The method of claim 12 , wherein a material of the third work function layer is substantially the same as a material of the first work function layer.
14. The method of claim 12 , wherein the third work function layer is in contact with the first work function layer.
15. The method of claim 12 , further comprising:
forming a fourth work function layer over the first and third work function layers, wherein a thickness of a portion of the fourth work function layer above the first semiconductor fin is substantially the same as a thickness of another portion of the fourth work function layer above the third semiconductor fin.
16. A method of manufacturing an integrated circuit chip, comprising:
doping a substrate with a p-type dopant to form a first p-well region in a first memory cell and a second p-well region in a second memory cell;
forming first and second semiconductor fins over the first and second p-well regions, respectively;
forming a first work function layer over the first semiconductor fin;
forming a second work function layer over the second semiconductor fin and having a material different from that of the first work function layer;
forming a third work function layer over the first work function layer; and
after forming the third work function layer, forming a metal fill layer over the first and second work function layers.
17. The method of claim 16 , wherein forming the first and second work function layers is performed such that a thickness of the first work function layer is different from a thickness of the second work function layer.
18. The method of claim 16 , wherein the first work function layer is of a pull down device in the first memory cell and the second work function layer is of a pull down device in the second memory cell.
19. The method of claim 16 , wherein the first work function layer comprises TiN.
20. The method of claim 16 , further comprising forming a barrier layer over the first semiconductor fin prior to forming the first work function layer.