Patent Assignment
Reel/Frame 049035/0802
Assignment of Assignor's Interest
Recorded: 2019-04-30
Pages: 5
Assignors
GOH, MOW HUAT
Executed: 2019-03-18
HUANG, JIANG
Executed: 2019-02-28
ZHU, YA PING
Executed: 2019-02-28
PARK, CHI KWAN
Executed: 2019-03-21
SONG, KENG YEW
Executed: 2019-03-13
Assignee
ASM TECHNOLOGY SINGAPORE PTE LTD
2 YISHUN AVENUE, SINGAPORE, 768924, SINGAPORE
Covered Property
(1)
Formation of Bonding Wire Vertical Interconnects
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.