Patent Assignment
Reel/Frame 049051/0757
Assignment of Assignor's Interest
Recorded: 2019-05-01
Pages: 7
Assignors
PARK, YOUNG-LIM
Executed: 2018-10-17
MOON, SUN-MIN
Executed: 2019-03-19
JUNG, CHANG-HWA
Executed: 2018-10-17
PARK, YOUNG-GEUN
Executed: 2018-10-17
SEO, JONG-BOM
Executed: 2018-10-17
CHO, KYU-HO
Executed: 2018-11-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device Having Dielectric Layer, and Method and Apparatus for Manufacturing the Integrated Circuit Device