Patent Assignment
Reel/Frame 049053/0327
Assignment of Assignor's Interest
Recorded: 2019-05-01
Pages: 4
Assignors
UZOH, CYPRIAN EMEKA
Executed: 2019-04-30
THEIL, JEREMY ALFRED
Executed: 2019-04-24
WANG, LIANG
Executed: 2019-04-24
KATKAR, RAJESH
Executed: 2019-04-25
GAO, GUILIAN
Executed: 2019-04-24
MIRKARIMI, LAURA WILLS
Executed: 2019-04-30
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Low Temperature Bonded Structures
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Feb 27, 2024
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 066698/0123 →
Change of Name
Nov 19, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073635/0465 →