IP Library › Assignment 066698/0123
Patent Assignment
Reel/Frame 066698/0123

Change of Name

Recorded: 2024-02-27 Pages: 4
Assignor
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (3)
Low Temperature Bonded Structures
Application: 16/363,894 →
Publication: US 2019/0319007
Low Temperature Bonded Structures
Application: 16/655,002 →
Publication: US 2020/0051937
Low Temperature Bonded Structures
Application: 17/559,485 →
Publication: US 2022/0165692
Related Assignments (6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 1, 2019
From: UZOH, CYPRIAN EMEKA; THEIL, JEREMY ALFRED; WANG, LIANG; KATKAR, RAJESH
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 049053/0327 →
Assignment of Assignor's Interest Mar 19, 2020
From: UZOH, CYPRIAN EMEKA; THEIL, JEREMY ALFRED; KATKAR, RAJESH; GAO, GUILIAN
To: INVENSAS BONDING TECHONOLGIES, INC.
Reel/Frame 052165/0254 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Assignment of Assignor's Interest Mar 8, 2022
From: UZOH, CYPRIAN EMEKA; THEIL, JEREMY ALFRED; KATKAR, RAJESH; GAO, GUILIAN
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 059199/0503 →
Security Interest May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →
Change of Name Nov 19, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073635/0465 →