Patent Assignment
Reel/Frame 049077/0881
Assignment of Assignor's Interest
Recorded: 2019-05-03
Pages: 3
Assignors
LEE, GUN
Executed: 2019-04-19
HWANG, JUN GUL
Executed: 2019-04-19
WOO, JI EUN
Executed: 2019-04-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →
Corrective Assignment to Correct the Conveying Party by Adding the Fourth Assignor Name Previously Recorded at Reel: 0490777 Frame: 0881. Assignor(S) Hereby Confirms the Assignment.
Jul 15, 2021
From: LEE, GUN; HWANG, JUN GUL; WOO, JI EUN; PARK, SUNG KEUN
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 056888/0293 →