Patent Assignment
Reel/Frame 049082/0770
Assignment of Assignor's Interest
Recorded: 2019-05-03
Pages: 4
Assignors
MAY, ROBERT ALAN
Executed: 2016-12-13
DARMAWIKARTA, KRISTOF KUWAWI
Executed: 2016-12-13
BOYAPATI, SRI RANGA SAI
Executed: 2016-12-13
GAAN, SANDEEP
Executed: 2016-12-13
PIETAMBARAM, SRINIVAS V.
Executed: 2016-12-13
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package Substrate Having Copper Alloy Sputter Seed Layer and High Density Interconnects