Patent Assignment
Reel/Frame 049092/0601
Assignment of Assignor's Interest
Recorded: 2019-05-06
Pages: 4
Assignors
KIM, WOON CHUN
Executed: 2019-04-19
PARK, JUN HEYOUNG
Executed: 2019-04-19
SHIM, JI HYE
Executed: 2019-04-19
PARK, SUNG KEUN
Executed: 2019-04-19
LEE, GUN
Executed: 2019-04-19
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Electromagnetic Interference Shielding Structure for the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.