Patent Assignment
Reel/Frame 049093/0104
Assignment of Assignor's Interest
Recorded: 2019-05-06
Pages: 3
Assignor
KARASHIMA, TAKASHI
Executed: 2019-01-25
Assignee
RENESAS ELECTRONICS CORPORATION
2-24, TOYOSU 3-CHOME, KOUTOU-KU, TOKYO, 135-0061, JAPAN
Covered Property
(1)
Semiconductor Device Including a Chip Capacitor Mounted on a Wiring Substrate