Patent Assignment
Reel/Frame 049120/0056
Assignment of Assignor's Interest
Recorded: 2019-05-08
Pages: 3
Assignors
OOI, GEORGE CHONG HEAN
Executed: 2019-03-28
TANG, LAI GUAN
Executed: 2019-04-01
TEH, CHEE HAK
Executed: 2019-03-28
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Network-On-Chip for Inter-Die and Intra-Die Communication in Modularized Integrated Circuit Devices
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.