Patent Assignment
Reel/Frame 049121/0063
Assignment of Assignor's Interest
Recorded: 2019-05-08
Pages: 4
Assignors
CHEN, CHING-WEN
Executed: 2019-04-24
KUO, HUNG-JUI
Executed: 2019-04-24
HO, MING-CHE
Executed: 2019-04-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Method of Forming the Same