IP Library › Assignment 049125/0742
Patent Assignment
Reel/Frame 049125/0742

Assignment of Assignor's Interest

Recorded: 2019-05-09 Pages: 3
Assignors
LEE, YUN TAE
Executed: 2019-04-04
SHIM, JUNG HO
Executed: 2019-04-04
KIM, HAN
Executed: 2019-04-04
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG) YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package Including Plurality of Semiconductor Chips on Common Connection Structure
Application: 16/388,004 →
Publication: US 2020/0266167
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 3, 2019
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049350/0756 →