Patent Assignment
Reel/Frame 049130/0166
Assignment of Assignor's Interest
Recorded: 2019-05-09
Pages: 6
Assignors
SANKMAN, ROBERT
Executed: 2019-05-09
HOSSAIN, MD ALTAF
Executed: 2019-05-07
NALAMALPU, ANKIREDDY
Executed: 2019-05-07
SUBBAREDDY, DHEERAJ
Executed: 2019-05-07
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Microelectronics Assembly Including Top and Bottom Packages in Stacked Configuration with Shared Cooling
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.