Patent Assignment
Reel/Frame 049136/0262
Assignment of Assignor's Interest
Recorded: 2019-05-10
Pages: 4
Assignors
HUANG, PO-YU
Executed: 2019-04-17
LIN, SHIH-CHE
Executed: 2019-04-17
WANG, CHAO-HSUN
Executed: 2019-04-17
CHAO, KUO-YI
Executed: 2019-04-17
WANG, MEI-YUN
Executed: 2019-04-17
CHANG, FENG-YU
Executed: 2019-04-17
LIN, RUEIJER
Executed: 2019-04-17
KAO, CHEN-YUAN
Executed: 2019-04-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Vertical Interconnect Features and Methods of Forming