Patent Assignment
Reel/Frame 049171/0405
Assignment of Assignor's Interest
Recorded: 2019-05-14
Pages: 4
Assignors
WANG, SUNG-LI
Executed: 2019-04-24
LIANG, SHUEN-SHIN
Executed: 2019-04-24
CHANG, JUNG-HAO
Executed: 2019-05-03
CHU, CHIA-HUNG
Executed: 2019-04-24
LIN, KENG-CHU
Executed: 2019-05-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structures and Methods of Forming the Same