Patent Assignment
Reel/Frame 049201/0498
Assignment of Assignor's Interest
Recorded: 2019-05-16
Pages: 2
Assignors
TSAI, YU-HSIANG
Executed: 2019-05-02
TSENG, CHUNG-CHUAN
Executed: 2019-05-02
LAI, CHIA-PING
Executed: 2019-05-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Trench Capacitor Layout Structure and Method of Forming Same Background
Patent:
10,546,917 →
Application:
16/117,479 →