Patent Assignment
Reel/Frame 049258/0661
Assignment of Assignor's Interest
Recorded: 2019-05-22
Pages: 6
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Open Pad Structure and Semiconductor Package Comprising the Same
Application:
16/418,865 →
Publication:
US 2020/0105694
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.