Patent Assignment
Reel/Frame 049261/0392
Assignment of Assignor's Interest
Recorded: 2019-05-23
Pages: 6
Assignors
CHEN, WEI-CHIH
Executed: 2019-05-07
KUO, HUNG-JUI
Executed: 2019-05-07
HU, YU-HSIANG
Executed: 2019-05-07
LIAO, SIH-HAO
Executed: 2019-05-07
WANG, PO-HAN
Executed: 2019-05-07
CHU, YUNG-CHI
Executed: 2019-05-07
CHO, HUNG-CHUN
Executed: 2019-05-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Manufacturing the Same