Package structure and method of manufacturing the same
A package structure includes a semiconductor die and a redistribution circuit structure. The redistribution circuit structure is disposed on and electrically connected to the semiconductor die and includes a patterned conductive layer, a dielectric layer, and an inter-layer film. The dielectric layer is disposed on the patterned conductive layer. The inter-layer film is sandwiched between the dielectric layer and the patterned conductive layer, and the patterned conductive layer is separated from the dielectric layer through the inter-layer film.
1. A package structure, comprising:
a semiconductor die; and
a redistribution circuit structure, disposed on and electrically connected to the semiconductor die, and comprising:
a patterned conductive layer;
a dielectric layer, disposed on the patterned conductive layer; and
an inter-layer film, sandwiched between the dielectric layer and the patterned conductive layer, wherein the inter-layer film comprises a nanostructure layer of poly-crystalline copper oxide, and the patterned conductive layer is separated from the dielectric layer through the inter-layer film.
2. The package structure of claim 1 , further comprising:
a seed layer, wherein the patterned conductive layer is disposed on the seed layer, and the patterned conductive layer is wrapped by the seed layer and the inter-layer film.
3. The package structure of claim 2 , wherein the patterned conductive layer is enclosed by the seed layer and the inter-layer film.
4. The package structure of claim 1 , wherein a first surface of the inter-layer film is in physical contact with the patterned conductive layer, a second surface of the inter-layer film is in physical contact with the dielectric layer, and the first surface is opposite to the second surface.
5. The package structure of claim 1 , wherein a thickness of the nanostructure layer is greater than or substantially equal to 5 nm and is less than or substantially equal to 250 nm.
6. The package structure of claim 1 , further comprising:
an insulating encapsulation, encapsulating the semiconductor die, wherein a surface of the insulating encapsulation is substantially coplanar to a surface of the semiconductor die, and the redistribution circuit structure is disposed on the surface of the insulating encapsulation substantially coplanar to the surface of the semiconductor die; and
conductive elements, located on and electrically connected to the redistribution circuit structure, wherein the redistribution circuit structure is located between the insulating encapsulation and the conductive elements.
7. The package structure of claim 1 , further comprising:
through vias, arranged aside of the semiconductor die and electrically connected to the redistribution circuit structure, wherein the through vias are electrically connected to the semiconductor die through the redistribution circuit structure;
an insulating encapsulation, encapsulating the semiconductor die and the through vias, wherein a surface of the insulating encapsulation is substantially coplanar to a surface of the semiconductor die and surfaces of the through vias, and the redistribution circuit structure is disposed on the surface of the insulating encapsulation substantially coplanar to the surface of the semiconductor die and the surfaces of the through via; and
conductive elements, located on and electrically connected to the redistribution circuit structure, wherein the redistribution circuit structure is located between the insulating encapsulation and the conductive elements.
8. The package structure of claim 1 , further comprising:
one or more than one semiconductor device, disposed on and electrically connected to the redistribution circuit structure, wherein the one or more than one semiconductor device is electrically communicated to the semiconductor die through the redistribution circuit structure.
9. The package structure of claim 1 , wherein the inter-layer film is electrically conductive.
10. The package structure of claim 1 , wherein the inter-layer film is electrically connected to the patterned conductive layer.
11. A method of manufacturing a package structure, comprising:
providing a semiconductor die having conductive terminals;
forming a redistribution circuit structure on the semiconductor die, wherein the redistribution circuit structure is electrically connected to the semiconductor die, and forming the redistribution circuit structure comprises:
depositing a first dielectric layer on the semiconductor die, the first dielectric layer exposing portions of the conductive terminals;
forming a patterned conductive layer on the first dielectric layer and electrically connecting the patterned conductive layer to the portions of the conductive terminals exposed by the first dielectric layer;
forming a inter-layer film on the patterned conductive layer, the inter-layer film comprising a nanostructure layer of poly-crystalline copper oxide, and the inter-layer film conformally covering the patterned conductive layer; and
depositing a second dielectric layer on the inter-layer film, wherein the patterned conductive layer is separated from the second dielectric layer through the inter-layer film; and
forming conductive elements on the redistribution circuit structure to electrically connect the conductive elements to the redistribution circuit structure.
12. The method of claim 11 , prior to forming the redistribution circuit structure, further comprising:
encapsulating the semiconductor die in an insulating encapsulation.
13. The method of claim 12 , prior to encapsulating the semiconductor die, further comprising:
forming through vias arranged aside of the semiconductor die, wherein the through vias are electrically connected to the semiconductor die through the redistribution circuit structure,
wherein encapsulating the semiconductor die further comprises encapsulating the through vias in the insulating encapsulation.
14. The method of claim 11 , after forming the redistribution circuit structure, further comprising:
disposing one or more than one semiconductor device on and electrically connected to the redistribution circuit structure.
15. The method of claim 11 , wherein forming the redistribution circuit structure further comprises:
forming a seed layer on the semiconductor die prior to forming the patterned conductive layer, the patterned conductive layer completely wrapped by the seed layer and the inter-layer film,
wherein the patterned conductive layer is formed on the seed layer and is electrically connected to the semiconductor die through the seed layer.
16. A method of manufacturing a package structure, comprising:
providing a semiconductor die;
encapsulating the semiconductor die in an insulating encapsulation;
forming a redistribution circuit structure on the insulating encapsulation, wherein the redistribution circuit structure is electrically connected to the semiconductor die, and forming the redistribution circuit structure comprises:
forming a patterned conductive layer on the semiconductor die, the patterned conductive layer electrically connecting the semiconductor die; and
depositing a dielectric layer on the patterned conductive layer and forming a nanostructure layer of poly-crystalline copper oxide between the dielectric layer and the patterned conductive layer; and
forming conductive elements on the redistribution circuit structure to electrically connect the redistribution circuit structure and the conductive elements.
17. The method of claim 16 , wherein
depositing the dielectric layer on the patterned conductive layer comprises mixing a dielectric material and an additive comprising small molecules or oligomers to form a dielectric material mixture and coating the dielectric material mixture on the patterned conductive layer to form the dielectric layer, and
forming the nanostructure layer of poly-crystalline copper oxide between the dielectric layer and the patterned conductive layer comprises subjecting the dielectric layer and the patterned conductive layer through a thermal treatment to form the nanostructure layer of poly-crystalline copper oxide between the dielectric layer and the patterned conductive-layer, wherein the additive comprised in the dielectric layer interacts with the patterned conductive layer in the thermal treatment to form the nanostructure layer of poly-crystalline copper oxide.
18. The method of claim 16 , prior to encapsulating the semiconductor die, further comprising:
forming through vias arranged aside of the semiconductor die, wherein the through vias are electrically connected to the semiconductor die through the redistribution circuit structure,
wherein encapsulating the semiconductor die further comprises encapsulating the through vias in the insulating encapsulation.
19. The method of claim 16 , after forming the redistribution circuit structure, further comprising:
disposing one or more than one semiconductor device on and electrically connected to the redistribution circuit structure.
20. The method of claim 16 , wherein forming the redistribution circuit structure further comprises:
forming a seed layer on the semiconductor die prior to forming the patterned conductive layer, the patterned conductive layer completely wrapped by the seed layer and the nanostructure layer of poly-crystalline copper oxide,
wherein the patterned conductive layer is formed on the seed layer and is electrically connected to the semiconductor die through the seed layer.