Patent Assignment
Reel/Frame 049275/0084
Assignment of Assignor's Interest
Recorded: 2019-05-24
Pages: 10
Assignors
TAKAI, KENJI
Executed: 2019-03-20
LEE, SANG EUI
Executed: 2019-03-27
KOKUBO, KEN
Executed: 2019-03-20
MIYAZAKI, EIGO
Executed: 2019-03-20
KIM, DO YOON
Executed: 2019-03-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Polishing Slurry, Method of Manufacturing the Same, and Method of Manufacturing Semiconductor Device