Patent Assignment
Reel/Frame 049277/0259
Assignment of Assignor's Interest
Recorded: 2019-05-24
Pages: 7
Assignors
CHEAH, BOK ENG
Executed: 2019-05-10
KONG, JACKSON CHUNG PENG
Executed: 2019-05-09
ONG, JENNY SHIO YIN
Executed: 2019-05-09
LIM, SEOK LING
Executed: 2019-05-10
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Vertical Modular Stiffeners for Stacked Multi-Device Packages