IP Library › Assignment 049277/0961
Patent Assignment
Reel/Frame 049277/0961

Assignment of Assignor's Interest

Recorded: 2019-05-24 Pages: 5
Assignors
CHEAH, BOK ENG
Executed: 2019-05-10
CHEE, CHOONG KOOI
Executed: 2019-05-09
KONG, JACKSON CHUNG PENG
Executed: 2019-05-10
TAN, TAT HIN
Executed: 2019-05-09
LEE, WAI LING
Executed: 2019-05-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Micro Through-Silicon via for Transistor Density Scaling
Application: 16/402,482 →
Publication: US 2020/0043831
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 9, 2025
From: INTEL CORPORATION
To: ALTERA CORPORATION
Reel/Frame 072704/0307 →
Security Interest Sep 12, 2025
From: ALTERA CORPORATION
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 073431/0309 →