IP Library › Assignment 049293/0949
Patent Assignment
Reel/Frame 049293/0949

Assignment of Assignor's Interest

Recorded: 2019-05-28 Pages: 3
Assignors
VISVANATHAN, KARTHIK
Executed: 2019-05-23
HOWELL, SHENAVIA S.
Executed: 2019-05-22
CHAN ARGUEDAS, SERGIO ANTONIO
Executed: 2019-05-22
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Integrated Circuit Packages with Asymmetric Adhesion Material Regions
Application: 16/423,664 →
Publication: US 2020/0381334
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 17, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072850/0834 →