Patent Assignment
Reel/Frame 049297/0284
Assignment of Assignor's Interest
Recorded: 2019-05-28
Pages: 4
Assignors
TU, SHUN-TSAT
Executed: 2019-05-23
KUO, CHUNKU
Executed: 2019-05-23
HOU, YA-TIAN
Executed: 2019-05-23
KUO, TSUNG-CHIEH
Executed: 2019-05-23
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Structure and a Method of Manufacturing the Same