Patent Assignment
Reel/Frame 049316/0463
Assignment of Assignor's Interest
Recorded: 2019-05-30
Pages: 3
Assignor
SUGIYA, TETSUKAZU
Executed: 2019-05-13
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Method of Processing a Semiconductor Wafer That Involves Cutting to Form Grooves Along the Dicing Lines and Grinding Reverse Side of the Wafer